INSTRUCTION MANUAL
CCG15
・
30
Series
TDK-Lambda
<Page>
18/23
Fig.7-2 Output Current vs. Ambient Temperature Measurement Method (for forced cooling)
Fig.7-1 Output Current vs. Ambient Temperature Measurement Method (for convection cooling)
(2) Output Current vs. Ambient Temperature Measurement Method (for forced cooling)
7.
Output Derating
7-1. Output Derating Measurement Method
There is no restriction on mounting direction but there should be enough consideration for airflow so
that heat dose not accumulate around the power supply vicinity. Determine external components
configuration and mounting direction on PCB such that air could flow around the power supply at
forced cooling and conventional cooling. The derating of the output current is necessary when the
ambient temperature is high. (See Output Current vs. Ambient Temperature.) Output Current vs.
Ambient Temperature is measured according to Fig.7-1 and Fig.7-2. When mounting on actual
device, do actual measurement based on measurement points shown in Fig.7-1 and Fig.7-2.
For this measurement, in order not to exceed the Rating temperature of the critical component, refer to
the case temperature measurement point shown on Fig.7-3.
(1) Output Current vs. Ambient Temperature Measurement Method (for convection cooling)
76mm
12
.7
m
m
PCB
Power supply
Ambient temperature
measurement point
CL
25.4mm
PCB
Power supply
Ambient temperature
and air velocity
measurement point
76
m
m
12.7mm
Airflow
Top view
Airflow
