Almost done with the parts on the pc board! This will finish up the soldering with the
organic flux.
Locate
the
MISC #1 bag and the IC bag.
Locate the ferrite beads (2). They are axial parts, gray colored with no markings.
These are non-polar, and are soldered into L1 and L2.
Locate the MTA-156 power connector. Solder into JP1. Note that the connector has
a “locking tab” on one side. This side is the “inside” facing relative to the pc board.
Note the silkscreen symbol for JP1 has a line on one side, indicating this is the side
where the locking tab goes.
Locate the LT1013 IC. Solder into U1, with the “dimple” on the top of the package on
Pin 1. Pin 1 has a square pad (all the others are round),
Locate the THAT 340P transistor array and solder in Q1. There is a “dimple” by
Pin 1.
Locate the SSM2220P and solder into Q5. The “notch” depression on the top of the
package matches the “notch” on the white silkscreen symbol.
Locate the CA3086s (2) and solder into Q7 and Q10 (match the “notches”).
Locate the BC550C transistors (3) and solder into Q3, Q4 and Q9. The flat side of
the transistor matches the flat side of the white silkscreen symbol.
Locate the BF245 FET transistor and solder into Q8. Note the center lead is angled
backwards slightly.
Locate the BC560C transistors (2) and solder into Q2 and Q6.
Apply a small bit of solder to the via holes. These are the small pads (no components
go in them) that allow traces to “change sides” of the pc board. DO NOT SOLDER
PADS FOR THE REMAINING COMPONENTS!! The via holes need a VERY
SMALL AMOUNT of solder. For example, there is a via hole on the top-side trace
that is above TP2, running along the edge of the board (by the “R9” white
silkscreen).
PART #3: BOARD WASH #2
Wash the board in warm water, gently scrubbing both sides.
Shake the board a couple of times, blot dry with an old towel (the leads will frazzle
a good towel). Let dry at least 15 minutes.
SYNTHESIS TECHNOLOGY
PAGE
7
MOTM-485 ASSEMBLY 8/11/05
WWW.SYNTHTECH.COM
Summary of Contents for MOTM-485 GX-1 Diode VCF
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