3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11DPG-HGX2 motherboard.
About This Motherboard
The X11DPG-HGX2 motherboard supports dual Intel® Xeon Scalable-SP and 2nd Generation
Intel® Xeon Scalable-SP series processors (Socket P) with a TDP (Thermal Design Power)
of up to 205W and three UPIs (Ultra Path Interconnect) support with a speed of up to 10.4
GT/s. With the Intel C621 chipset built-in, this motherboard supports up to 6TB of DDR4
3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM ECC 2933*/2666/2400/2133 MHz memory in
24 slots (*
Note
below). It also supports up to 9TB memory with DCPMM modules installed.
X11DPG-HGX2 is optimized for High-Performance Computing (HPC), deep learning, or
artificial intelligence platforms. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at
http://www.supermicro.com/products/
Note:
Support for 2933MHz memory is dependent on the CPU SKU.
Manual organization
Chapter 1
describes the features, specifications and performance of the motherboard, and
provides detailed information on the Intel C621 chipset.
Chapter 2
provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.
Chapter 3
describes troubleshooting procedures for video, memory, and system setup stored
in the CMOS.
Chapter 4
includes an introduction to the BIOS and provides detailed information on running
the CMOS Setup utility.
Appendix A
lists software program installation instructions
.
Appendix B
lists standardized warning statements in various languages
.
Appendix C
lists UEFI BIOS Recovery instructions
.
Appendix D
provides information on how to configure VROC RAID settings
.
Appendix E
provides information on how to configure secure boot settings
.
