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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual Intel Xeon 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 cores and a thermal design power (TDP) of
up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A
BIOS
AMI BIOS
ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time Clock)
wakeup, and SMBIOS 3.0 or later
Memory
Up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz
in 16 memory slots and up to 4 TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHz
Storage Drives
Drive Bays:
Eight hot-swap SATA drive slots (optional SAS support on slots 0-7 and optional NVMe support on slots 0-3)
Optional two fixed SATA or NVMe drive bays
Connectors:
Two onboard NVMe connectors
One VROC Key header
PCI Expansion Slots
One PCIe 3.0 x8 slot
Five PCIe 3.0 x16 slots
Two onboard PCIe 4.0 x4 M.2 slots in the 2280 and 22110 form factors
Networking
Two 10GbE LAN ports
Input/Output
COM: one onboard serial COM header
SATA: eight onboard S-SATA 3.0 ports (two are SuperDOM supported)
VGA: one rear VGA port
USB: four rear USB 3.0 ports, one rear USB 3.1 ports
Audio: 7.1 HD Audio rear ports, one onboard buzzer header
Motherboard
X12DAi-N6
Chassis
CSE-745BTS-R1K23BP3
Security
Onboard TPM/Port 80 header
System Cooling
Three 8-cm internal hot-swappable fans, two external heavy-duty hot-swappable fans, two CPU heatsinks, one air shroud