103
Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Generation Intel Xeon Scalable series [Socket P+ (LGA4189)] processor with up to 32 cores and a thermal design power
(TDP) of up to 205W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621A
BIOS
256Mb AMI BIOS® SPI Flash BIOS
Memory
Eight slots support up to 2048GB of ECC RDIMM/LRDIMM/LRDIMM (3DS) with speeds up to 3200MHz; DIMM size up to
256GB at 1.2V
Storage Drives
Four fixed internal SATA3 2.5" drive bays
PCI Expansion Slots
Three PCIe 4.0 x16 slots
One M.2 PCIe 3.0 x4/SATA3 Slot (supports M-Key 2280 and 22110)
Input/Output
Network: Two 10GbE LAN ports
IPMI: Dedicated LAN port
USB: Four USB 3.0 ports, two USB 2.0 ports
Video : One VGA port
Serial: One serial port
Motherboard
X12SPW-TF-001; 8" (W) x 13" (L) (203.2mm x 330.2mm)
Chassis
CSE-E403iF-000NBP
Box Wall Mount, (WxHxD) 10.5 x 4.3 x 16in (267 x 109 x 406mm)
System Cooling
Three 8 x 3.8-cm heavy duty fans, one CPU heatsink, and one air shroud to direct airflow
Power Supply
Model: PWS-601-1H
AC Input Voltages: 100-240VAC
Rated Input Current: 3.5A-7.5A
Rated Input Frequency: 50-60Hz
Rated Output Power: 600W Single
Rated Output Voltages: +3.3V (16A), +5V (20A), +12V (49A (100-140VAC), 56A (180-240VAC)), +5VSB (3A)
Operating Environment
Operating Temperature: 0º to 45º C (32º to 113º F)
Non-operating Temperature: -40º to 70º C (-40º to 158º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
