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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in a P+ (LGA4189) socket with up to 56 cores and the thermal design power
(TDP) of up to 250W, Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A (LBG-R)
BIOS
AMI 64Mb SPI Flash ROM
Memory
Thirty-two slots for up to 12TB of 3DS Load Reduced DIMM (3DS LRDIMM), 3DS Registered DIMM (3DS RDIMM), or Non-
Volatile DIMMs (NV-DIMM) ECC memory with speeds of 3200/2933/2666 MHz, and Intel Optane PMem 200 series; DIMM
size up to 256 GB at 1.2 V.
Note 1:
Intel Optane PMem 200 series memory is supported by the 3rd Gen Intel Xeon Scalable
(83xx/63xx/53xx/4315) Series only.
Storage Drives
Twelve hot-swap 3.5" bays for SAS/SATA/NVMe, SAS with additional parts
Two SuperDOM (Disk on Module) headers
PCI Expansion Slots
Five PCIe 4.0 x8
One PCIe 4.0 x16
One PCIe 4.0 low-profile x16
One PCIe 4.0 low-profile, internal x8
Input/Output
Network: Two to four LAN ports, varies by Ultra Riser Card
BMC: Dedicated LAN port
USB: Two USB 3.0 ports
Video : One VGA port
COM: One serial port
Motherboard
X12DPU-6; 16.8" (W) x 17.00" (L) (426.72 mm x 431.80 mm)
Chassis
829U3TS-R1K22P-T; 2U Rackmount, (WxHxD) 17.2” x 3.5” x 27.8” (437 x 89 x 706mm)
System Cooling
Four 8-cm heavy-duty PWS fans, two CPU heatsinks, two air shrouds to direct air flow
Power Supply
Model: PWS-1K62A-1R, 1600W redundant modules, 80Plus Titanium level; Optional: 1600W/2000W
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
+12V
83A (100 Vac–127 Vac)
133A (200 Vac–240 Vac)
+12 V standby: 2.1A