Supermicro SuperBlade SBI-4129P-C2N, User Manual

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SBI-4129P-T3N/C2N SuperBlade Module User’s Manual
3-8
Attaching the Processor Package Assembly to the Heatsink
to Form the Processor Heatsink Module (PHM)
After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly
onto the heatsink to create the Processor Heatsink Module (PHM).
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index finger pressing against the screw at this triangular corner, carefully
hold and turn the heatsink upside down with the thermal-grease side facing up.
Remove the protective thermal film if present, and apply the proper amount of the
thermal grease as needed. (Skip this step if you have a new heatsink because the
necessary thermal grease is pre-applied in the factory.)
2. Holding the processor package assembly at the center edge, turn it upside down.
With the thermal-grease side facing up, locate the hollow triangle located at the
corner of the processor carrier assembly ("a" in the graphic). Note a larger hole and
plastic mounting clicks located next to the hollow triangle. Also locate another set of
mounting clicks and a larger hole at the diagonal corner of the same (reverse) side
of the processor carrier assembly ("b" in the graphic).
3. With the back of heatsink and the reverse side of the processor package assembly
facing up, align the triangular corner on the heatsink ("A" in the graphic) against the
mounting clips next to the hollow triangle ("a") on the processor package assembly.
4. Also align the triangular corner ("B") at the diagonal side of the heatsink with the
corresponding clips on the processor package assembly ("b").
5. Once the mounting clips on the processor package assembly are properly aligned
with the corresponding holes on the back of heatsink, securely attach the heatsink
to the processor package assembly by snapping the mounting clips at the proper
places on the heatsink to create the processor heatsink module (PHM).