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Chapter 1: Introduction
1.3 Blade Module Features
The table below lists the main features of the SBI-4119MG-X SuperBlade module. See the
proceeding section for components typically included in a blade system and other optional
components. Specific details for the SBI-4119MG-X blade module are found in Chapter 3:
"Blade Module Features".
SBI-4119MG-X
SuperBlade Modules Specification Features
Specification
Description
Mainboard
B11SCG-CTF (proprietary form factor)
Processors
Single Intel™ Xeon® E 2100 series Socket H4 (LGA 1151) processor for each node.
Please refer to our website for a complete listing of supported processors.
Chipset
One Intel C246 chip set
Graphics Controller
Integrated Aspeed AST2500 VGA graphics chip for each node
BIOS
128 Mb SPI Flash EEPROM with AMI® BIOS for each node
Memory Capacity
Supports up to 128 GB ECC UDIMM DDR4 2666/2400/2133 MHz speed memory in
32GB, 16GB, 8GB, 4GB size 288-pin DIMM sockets. See
support/resources/memory/X11_memory_config_guide.pdf
for details.
Storage
One NVMe/SATA3 M.2 slot, one SATA DOM port
Add-on Cards
The SBI-4119MG-X blade modules can use optional add-on cards for a TPM 2.0
security module, Intel VROC RAID card or a Hardware RSTe key upgrade module.
System Weight
9.5 lbs (4.3 kg)
System Dimensions
(HxWxD): 6.5 x 1.75 x 23.5" (165.1 x 44.45 x 596.9-mm)
Processors
The SBI-4119MG-X SuperBlade module supports a single Intel Xeon E-2100,
Socket H4 (LGA 1151) series processor.
Refer to the Supermicro website for a complete listing of supported processors (
supermicro.com/products/superblade
). Please note that you will need to check the detailed
specifications of a particular blade module for a list of the CPUs it supports.
Details on installation of the processor into the SBI-4119MG-X SuperBlade module are found
in Chapter 2: "Setup and Installation".
Memory
The SBI-4119MG-X SuperBlade module has four 288-pin DIMM sockets that can support up
to 128 GB ECC UDIMM DDR4 2666/2400/2133 MHz speed, 32GB, 16GB, 8GB, 4GB size
memory per node. Memory is interleaved, which requires modules of the same size and
speed to be installed in groups (of two or three).
