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Chapter 1: Introduction
1.3 System Features
The following is an overview of the main features.
System Features
Motherboard
H12DSU-iN
Chassis
819UTS-R1K02P-A
CPU
Dual AMD EPYC 7003/7002 series in SP3 sockets (7003 Series Processor drop-in support requires BIOS
version 2.0 or newer)
Chipset
System on Chip
Memory
Up to 8 TB of ECC DDR4 3200 MHz speed, RDIMM/LRDIMM/3DS/NVDIMM memory in 32 slots
Storage Drives
Four hot-swap 3.5" bays for choice of:
SATA3 (default)
NVMe (cable included; additional drive trays required)
SAS3 (optional SAS card and kit required)
M.2 NVMe (optional AOC required)
Expansion Slots
Two full height, 9.5"-length x16 PCIe 4.0
One low profile x16 PCIe 4 .0
One internal low-profile PCIe 4.0 x16 (proprietary design)
Cooling
Eight mid-chassis 4-cm counter-rotating fans; two air shrouds, two CPU heatsinks
Power
1000 W redundant 80 Plus Titanium level modules
(Full redundancy based on configuration and application load)
Input/Output
LAN: Two 10 Gbps ports by means of the Ultra card; one dedicated IPMI port
USB 3.0:
Two ports on the rear I/O panel (USB0/1)
One type A header (Internal)
Two SATA DOM (Device on Module) power connectors
One COM port
One VGA port
Form Factor
1 U rackmount; (WxHxD) 17.2 x 1.7 x 29 in. (437 x 43 x 737 mm)
