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SR/AI
SR/AP
Hardware Reference
Release r09
Page 51 of 76
6.3 Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adapted to your process and
other re-flow parameters for example the used solder paste. The paste manufacturer provides a re-
flow profile recommendation for his product.
Figure 18: Soldering Temperature-Time Profile (For Reflow Soldering)
Preheat
Main Heat
Peak
tsmax
tLmax
tpmax
Temperature
Time
Temperature
Time
Temperature
Time
[°C]
[sec]
[°C]
[sec]
[°C]
[sec]
150
100
217
90
260
10
230
50
Average ramp-up rate
[°C / sec]
3
Average ramp-down rate
[°C / sec]
6
Max. Time 25°C to Peak
Temperature
[min.]
8
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to 1 re-flows to a maximum
temperature of 260°C. The reflow soldering profile may only be applied if the SR resides
on the PCB side looking up. Heat above the solder eutectic point while the SR is
mounted facing down may damage the module permanently.
Summary of Contents for BlueMod+SR/AI
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