Package information
STM32F031x4 STM32F031x6
DocID025743 Rev 3
7.5 WLCSP25
package information
7.6 WLCSP25
package information
Figure 43. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale
package outline
1.
Drawing is not to scale.
Table 65. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale
package mechanical data
Symbol
millimeters
inches
(1)
Min
Typ
Max
Min
Typ
Max
A
0.525
0.555
0.585
0.0207
0.0219
0.0230
A1
-
0.175
-
-
0.0069
-
A2
-
0.380
-
-
0.0150
-
A3
(2)
-
0.025
-
-
0.0010
-
b
(3)
(4)
0.220
0.250
0.280
0.0087
0.0098
0.0110
D
2.388
2.423
2.458
0.0940
0.0954
0.0968
E
2.29
2.325
2.36
0.0902
0.0915
0.0929
e
-
0.400
-
-
0.0157
-
e1
-
1.600
-
-
0.0630
-
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http://www.vicor.top/
021-31660491