Board
assembly and layout
UM2301
50/57
DocID031141 Rev 1
Figure 59: STEVAL-ISB044V1 evaluation board: DC-DC boost routing details
Figure 60: STEVAL-ISB044V1 evaluation board: power GND routing details
Bridge nets are designed on the top layer; traces must be very large
(>2 mm).
VIN
VDCDC
DEMAGNET
C217
22 µF
R200
10R
C206
5.6NF
C216
470pF
Q203
N-MOS
STL10N3LLH5
5
4
1
6
7
8
2
3
C209 1NF
R215
100K
TP200
1
C207
R214
0R
+
C205
D202
4.3V
C208
D201
STPS8L30DEE
C203
C200
NP
R205
0.068R
C204
L200
4.7 µH
C202
100NF
R202
1K
R204
470R
10 µF
10 µF
100 µF
22 µF
22 µF
Net VIN
Net L200 D201-QQ203
Net D201-C205
Net Q203
R205
VIN
C217
22 µF
R200
Q203N-MOS
STL10N3LLH5
5
4
1
6 7 8
2 3
1
4
R205
0.068R
R204
470R
GND from R205 and
C217: high current
A lot of vias
ONLY in this area
12 V DC
USB_VCC_QC
TP100
WIRE_SOLDER
1
J100
PJ-002A
2
3
1
J101
1
3
2
D100
SMM4F13A
C100
NP
C102
NP
C101
10 µF
TP101
WIRE_SOLDER
1
C114
NP
C112
100NF
GND directly connected to
TP101 and Capa
connect bottom side with a
lot of vias
10 R
GND VBOOST and
GND Capa of tank
on the same area
Insert many vias
for high current
ONLY in this area
GND from R307:
connected near GND
from " GND VBOOST"
Direct GND line connection
TP302
1
TP303
1
R307
0.022R
VRSENSE
POWER_NODE
C300
47NF
C301
47NF
C304
47NF
C302
47NF
VDCDC
C206
5.6NF
TP200
1
C207
+
C205
C208
C203
C204
C202
100NF
10 µF
10 µF
100 µF
22 µF
22 µF
