Doc ID TBD Rev 0.8
Rev 0.1
13/19
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3.5
Module reflow installation
The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final
assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-
020C, July 2004 recommendations.
Table 8. Soldering profile
Profile feature
Lead-free assembly
Average ramp-up rate (T
SMAX
to T
P
)
3 °C/sec max
Preheat:
– Temperature min. (T
S
min.)
– Temperature max. (T
S
max.)
– Time (t
s
min. to t
s
max.)(t
s
)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature T
L
– Temperature T
L
217 °C
60-70 sec
Peak temperature (T
P
)
240 °C
Time within 5 °C of actual peak temperature (T
P
)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.
Figure 6. Soldering profile