Electrical data
L6472
10/70
DocID022729 Rev 5
2.3 Thermal
data
Table 4. Thermal data
Symbol
Parameter
Package
Typ.
Unit
R
thJA
Thermal resistance junction ambient
HTSSOP28
(1)
22
°C/W
POWERSO36
(2)
12
1. HTSSOP28 mounted on the EVAL6472H Rev 1.0 board: four-layer FR4 PCB with a dissipating copper surface of about 40
cm
2
on each layer and 15 via holes below the IC.
2. POWERSO36 mounted on the EVAL6472PD Rev 1.0 board: four-layer FR4 PCB with a dissipating copper surface of about
40 cm
2
on each layer and 22 via holes below the IC.