Sony XR-CA310, Service Manual

Page: 2 / 38

2
XR-CA310/L210
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
Installation ....................................................................... 4
Connections ..................................................................... 5
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 8
2-2. Sub Panel ......................................................................... 9
2-3. Mechanism Deck (MG-36SZ11-32) ............................... 9
2-4. MAIN Board ................................................................... 10
2-5. Bracket (MD) .................................................................. 10
2-6. Heat Sink ......................................................................... 11
2-7. Motor (Capstan/Reel) (M901) ........................................ 11
2-8. Head (Play Back) (HP901) ............................................. 12
2-9. Main Belt, Sub Belt (C) .................................................. 13
3. MECHANICAL ADJUSTMENTS
....................... 14
4. ELECTRICAL ADJUSTMENTS
......................... 14
Tape Deck Section .......................................................... 15
Tuner Section .................................................................. 16
5. DIAGRAMS
5-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
5-2. Printed Wiring Board – MAIN Board – ........................ 21
5-3. Schematic Diagram – MAIN Board (1/2) – .................. 22
5-4. Schematic Diagram – MAIN Board (2/2) – .................. 23
5-5. Printed Wiring Board – CONTROL Board – ................ 24
5-6. Schematic Diagram – CONTROL Board – ................... 25
5-7. IC Pin Function Description ........................................... 26
6. EXPLODED VIEWS
6-1. General Section ............................................................... 28
6-2. Front Panel Section ......................................................... 29
6-3. Mechanism Deck Section (MG-36SZ11-32) ................. 30
7. ELECTRICAL PARTS LIST
............................... 31