Sony XR-C8100R, Service Manual

Page: 30 / 60

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
• For printed wiring boards.
• X : parts extracted from the component side.
•
p
: parts mounted on the conductor side.
•
r
: Through hole.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
• Abbreviation
G : German model.
– 32 –
MAIN board
REEL board
KEY board
SUB board
SUPER CAPACITOR board
6-4. CIRCUIT BOARDS LOCATION
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• For schematic diagrams.
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise
specified.
• % : indicates tolerance.
•
¢
: internal component.
• C : panel designation.
•
U
: B+ Line.
• H : adjustment for repair.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltage is dc with respect to ground under no-signal
(detuned) condition.
no mark : FM
(
) : MW
< > : PB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
F : FM
f
: MW
E
: PB
• Abbreviation
G : German model.