SRS-T70
– 7 –
– 8 –
3-2.
PRINTED WIRING BOARD
• Semiconductor
Location
Ref. No.
Location
D1
A-1
D2
B-1
D3
B-2
IC1
B-5
IC2
B-3
Q1
A-3
Q2
A-2
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
z
: Through hole.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
