– 2 –
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
Setting up the base phone ...............................................
4
Preparing the battery pack ..............................................
4
Making calls ....................................................................
5
Receiving calls ................................................................
6
Speed dialing ...................................................................
6
Switching the phones during a call .................................
7
Talking between the phones (Intercom) .........................
7
Voice paging ....................................................................
7
Transferring a call ...........................................................
7
Mounting the base phone on a wall ................................
8
Checking the package contents .......................................
8
3.
DISASSEMBLY
.........................................................
9
4.
900 MHz SYSTEM OPERATION
4-1. Access Method ................................................................ 12
4-2. Protocol ........................................................................... 12
5.
TEST MODE
5-1. Base Unit ......................................................................... 15
5-2. Handset ............................................................................ 16
5-3. RF Testing ....................................................................... 17
6.
ELECTRICAL ADJUSTMENTS
6-1. Base Unit Section ............................................................ 19
6-2. Handset Section ............................................................... 20
7.
DIAGRAMS
7-1. Block Diagram – BASE UNIT Section – ...................... 23
7-2. Block Diagram – HANDSET Section – ........................ 25
7-3. Notes for Printed Wiring Boards
and Schematic Diagrams ................................................ 27
7-4. Printed Wiring Board
– BASE MAIN Board (Side A)/
BASE MICROPHONE Board (Side A) – ....................... 27
7-5. Printed Wiring Board
– BASE MAIN Board (Side B)/
BASE MICROPHONE Board (Side B) – ....................... 29
7-6. Schematic Diagram – BASE MAIN Section (1/3) – .... 31
7-7. Schematic Diagram – BASE MAIN Section (2/3) – .... 33
7-8. Schematic Diagram – BASE MAIN Section (3/3) – .... 35
7-9. Printed Wiring Board – BASE KEY Section – ............. 37
7-10. Schematic Diagram – BASE KEY Section – ................ 38
7-11. Printed Wiring Board – HANDSET Section – .............. 39
7-12. Schematic Diagram – HANDSET Section – ................. 41
7-13. IC Pin Function Description ........................................... 43
................................................ 51
9.
ELECTRICAL PARTS LIST
............................... 53
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED
LINE WITH MARK
!
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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TEL 13942296513 QQ 376315150 892498299
