1. PRINTED WIRING BOARD (DSP SECTION)
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
G
H
I
J
– 3 –
– 4 –
D1
F-3
D2
C-3
D3
D-4
IC1
D-2
IC2
D-1
IC3
C-7
IC4
F-2
IC6
H-8
IC7
I-9
IC8
I-2
Q1
D-1
Q2
F-1
Q3
F-2
Q4
F-2
Q5
F-2
Q6
F-2
Q7
G-2
Q8
C-1
Q9
I-4
Q10
H-1
Q13
J-4
Q14
C-1
ZD1
H-4
ZD2
C-3
Ref. No.
Location
r
Semiconductor
Location
Note:
•
X
: parts extracted from the component side.
•
r
: Through hole.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
SPP-A940
