20
20
SPP-114
5-4. PRINTED WIRING BOARD — BASE UNIT SECTION —
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
p
: parts mounted on the conductor side.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
D1
B-2
D51
G-2
D101
D-8
D201
B-9
D203
B-8
D204
B-8
D205
B-7
D301
C-7
D401
B-5
D501
G-7
IC101
E-4
IC301
G-10
IC501
F-8
PH201
C-8
Q51
E-1
Q52
F-2
Q54
E-2
Q201
B-6
Q202
D-6
Q301
D-8
Q302
F-10
Q401
A-2
Q402
B-4
Q403
B-4
• Semiconductor
Location
Ref. No.
Location
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
H
: adjustment for repair.
• Power voltage is dc 9 V and fed with regulated dc power
supply from external power voltage jack.
• Power voltage is dc 12 V and fed with regulated dc power
supply from MJ201 with 100
Ω
in series.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : TALK
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
N
: TX (To Tel Line)
O
: RX (From Tel Line)
P
: bell
