NW-S603/S605/S703F/S705F/S706F
15
15
NW-S603/S605/S703F/S705F/S706F
•
Note for Printed Wiring Boards and Schematic Diagrams
•
All board are multi-layer printed board.
However, the patterns of intermediate-layers have not been
included in diagrams.
•
Lead Layouts
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
•
A
: B+ Line.
•
Power voltage is dc 3.7 V and fed with regulated dc power
supply from CN601 pin
1
and pin
2
on the MAIN board.
•
Voltages are dc with respect to ground under no-signal
conditions.
no mark : PLAY BACK
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Signal path.
F
: AUDIO
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
*
Replacement of IC201, IC2701, IC3005 and IC3007 on
the MAIN board used in this set requires a special tool.
Lead layout of conventional IC
CSP (chip size package)
surface
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
*
Replacement of IC201, IC2701, IC3005 and IC3007 on
the MAIN board used in this set requires a special tool.