2
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
Getting Started ......................................................................... 3
Basic Operations ...................................................................... 5
Editing Messages ..................................................................... 8
Formatting a “Memory Stick” ................................................. 9
2. DISASSEMBLY
2-1. Knob (Rear) ....................................................................... 10
2-2. Chassis Block Assy ........................................................... 11
2-3. SW Board .......................................................................... 11
2-4. Plate (MS) Section ............................................................ 12
2-5. LCD Board ........................................................................ 12
2-6. Chassis Section ................................................................. 13
2-7. Memory Stick Connector .................................................. 13
2-8. Main Board ....................................................................... 14
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 15
3-2. Block Diagram – Main Section – ...................................... 21
3-3. Block Diagram – LCD/SW Section – ............................... 22
3-4. Printed Wiring Board – Main Section – ............................ 24
3-5. Schematic Diagram – Main Section (1/3) – ...................... 25
3-6. Schematic Diagram – Main Section (2/3) – ...................... 26
3-7. Schematic Diagram – Main Section (3/3) – ...................... 27
3-8. Schematic Diagram – LCD/SW Section – ........................ 28
3-9. Printed Wiring Board – LCD Section – ............................ 29
3-10. Printed Wiring Board – SW Section – .............................. 30
3-11. IC Block Diagrams ............................................................ 31
4. EXPLODED VIEWS
4-1. Main Section ..................................................................... 34
4-2. Case Section ...................................................................... 35
4-3. Ornament Section .............................................................. 36
4-4. Chassis (1) Section ............................................................ 37
4-5. Chassis (2) Section ............................................................ 38
5. ELECTRICAL PARTS LIST
......................................... 39
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ICD-BM1/BM1PRO
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
* Replacement of IC601, IC702 used in this set requires a special
tool.
•
The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
• Lead layouts
Lead layout of
conventional IC
surface
CSP (chip size package)
Summary of Contents for ICDBM1 - Memory Stick Media Digital Voice Recorder
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