2
ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
TABLE OF CONTENTS
1.
GENERAL
Index to Parts and Controls .............................................
3
Using the Display Window ..............................................
3
Setting the Clock .............................................................
3
2.
DISASSEMBLY
2-1.
Knob (Rear) .....................................................................
4
2-2.
Chassis Block Assy .........................................................
5
2-3.
SW Board ........................................................................
5
2-4.
Plate (MS) Section ...........................................................
6
2-5.
LCD Board ......................................................................
6
2-6.
Chassis Section ................................................................
7
2-7.
Memory Stick Connector ................................................
7
2-8.
Main Board ......................................................................
8
3.
DIAGRAMS
3-1.
Block Diagram – Main Section – ....................................
9
3-2.
Block Diagram – LCD/SW Section – ............................. 10
3-3.
Printed Wiring Board – Main Section – .......................... 12
3-4.
Schematic Diagram – Main Section (1/3) – .................... 13
3-5.
Schematic Diagram – Main Section (2/3) – .................... 14
3-6.
Schematic Diagram – Main Section (3/3) – .................... 15
3-7.
Schematic Diagram – LCD/SW Section – ...................... 16
3-8.
Printed Wiring Board – LCD Section– ............................ 17
3-9.
Printed Wiring Board – SW Section– .............................. 18
4.
EXPLODED VIEWS
4-1.
Main Section .................................................................... 27
4-2.
Case Section .................................................................... 28
4-3.
Ornament Section ............................................................ 29
4-4.
Chassis (1) Section .......................................................... 30
4-5.
Chassis (2) Section .......................................................... 31
5.
ELECTRICAL PARTS LIST
.................................. 32
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
* Replacement of IC601, IC702 used in this set requires a special
tool.
•
The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
•
Lead layouts
Lead layout of
conventional IC
CSP (chip size package)
surface
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
