11
11
ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
ICD-BM1/BM1A/BM1AVTP/BM1B/BM1DR9
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PB
L
: REC
*
IC601, IC702 on main board are not replaceable.
• The voltages and Waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Common Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
z
: Through hole.
•
: Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Waveforms
*
IC601, IC702 on main board are not replaceable.
•
Lead Layouts
Lead layout of
conventional IC
CSP (chip size package)
surface
