1-194
HDC1000/V2 (J, E)
(TG-243 BOARD (SUFFIX 23-))
Ref. No.
or Q’ty Part No. SP Description
R365 1-208-863-81 s RES, CHIP 100 (1005)
R367 1-208-863-81 s RES, CHIP 100 (1005)
R369 1-208-863-81 s RES, CHIP 100 (1005)
R371 1-208-863-81 s RES, CHIP 100 (1005)
R373 1-208-863-81 s RES, CHIP 100 (1005)
R375 1-208-911-81 s RES, CHIP 10K (1005)
R376 1-208-863-81 s RES, CHIP 100 (1005)
R377 1-208-895-81 s RES, CHIP 2.2K (1005)
R379 1-208-895-81 s RES, CHIP 2.2K (1005)
R381 1-208-895-81 s RES, CHIP 2.2K (1005)
R383 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R385 1-208-863-81 s RES, CHIP 100 (1005)
R387 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R389 1-208-863-81 s RES, CHIP 100 (1005)
R391 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R393 1-208-863-81 s RES, CHIP 100 (1005)
RB1 1-234-370-21 s RES, NETWORK 22 (1005X4)
S1 1-771-709-41 s SWITCH, SLIDE
X1 1-813-529-11 s OSCILLATOR, CRYSTAL (VCXO) 3.3
X2 1-813-530-11 s OSCILLATOR, CRYSTAL (VCXO) 3.3
-----------------------------------------
TG-243BG BOARD (SUFFIX -22) [HDC1400(UC)]
-----------------------------------------
Ref. No.
or Q’ty Part No. SP Description
1pc
!
A-1271-237-A s MOUNTED CIRCUIT BOARD, TG-243BG
C1 1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C2 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C3 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C4 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C5 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C6 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C7 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C8 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C11 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C12 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C13 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C14 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C15 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C16 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C17 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C18 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C19 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C20 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C21 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C22 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C23 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C24 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C25 1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C26 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C27 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C28 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C29 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C30 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C31 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C34 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C35 1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C36 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C37 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C39 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C40 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C41 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C43 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C44 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C45 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C46 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C49 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C51 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C54 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C55 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C56 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C57 1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C58 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C60 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C61 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C63 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C64 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C65 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C66 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
Summary of Contents for HDC1000 series
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