1-163
HDC1000/V2 (J, E)
(SDI-84C BOARD (SUFFIX 13,14))
Ref. No.
or Q’ty Part No. SP Description
C262 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C263 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C264 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C265 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C266 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C267 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C268 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C269 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C270 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C271 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C272 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C273 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C274 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C275 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C289 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C401 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C403 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C407 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C410 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C414 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C416 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C417 1-216-864-91 s CONDUCTOR, CHIP (1608)
C418 1-216-864-91 s CONDUCTOR, CHIP (1608)
C420 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C421 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C422 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C423 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C424 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C425 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C426 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C427 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C428 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C429 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C430 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C431 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C432 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C433 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C436 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C438 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C439 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C441 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C443 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C444 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C445 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C446 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C447 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C448 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C449 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C450 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C451 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C452 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C453 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C454 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C455 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C456 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C457 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C458 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C459 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C460 1-165-989-91 s CAP, CERAMIC 10MF (2012)
(SDI-84C BOARD (SUFFIX 13,14))
Ref. No.
or Q’ty Part No. SP Description
C461 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C462 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C463 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C464 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C465 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C466 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C467 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C468 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C469 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C470 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C471 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C472 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C473 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C474 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C475 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C476 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C704 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C707 1-216-295-91 s CONDUCTOR, CHIP (2012)
C802 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C803 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C804 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C805 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C806 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C807 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C808 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C809 1-100-620-91 s CAP, CHIP CERAMIC 47MF B(3225)
C810 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C812 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C813 1-100-620-91 s CAP, CHIP CERAMIC 47MF B(3225)
C814 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C815 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C816 1-100-620-91 s CAP, CHIP CERAMIC 47MF B(3225)
CN102 1-695-480-21 o PIN, CONNECTOR (PC BOARD) 2P
CN201 1-764-243-31 o CONNECTOR (COAXIAL)
CN202 1-764-080-21 o PIN, CONNECTOR (PC BOARD) 8P
CP201
!
1-417-611-11 s CONVERSION MODULE,E/O,EO-300
CP401 1-417-612-11 s CONVERSION MODULE,O/E,OE-301
D101 8-719-017-03 s DIODE 02DZ4.7-TPH3
D102 8-719-017-03 s DIODE 02DZ4.7-TPH3
D103 8-719-037-41 s DIODE RD20SB-T1
D104 8-719-161-05 s DIODE RD8.2SB-T1
D105 8-719-989-77 s DIODE SC802-04-TE12RA
D106 8-719-989-77 s DIODE SC802-04-TE12RA
D107 8-719-989-77 s DIODE SC802-04-TE12RA
D108 8-719-989-77 s DIODE SC802-04-TE12RA
D109 8-719-017-03 s DIODE 02DZ4.7-TPH3
D110 8-719-017-03 s DIODE 02DZ4.7-TPH3
D111 8-719-820-42 s DIODE 1SS302-TE85L
D112 8-719-036-91 s DIODE RD5.1SB-T1
D113 8-719-036-91 s DIODE RD5.1SB-T1
D114 8-719-820-42 s DIODE 1SS302-TE85L
E1 1-535-877-22 s CHIP, CHECKER
E2 1-535-877-22 s CHIP, CHECKER
FB101 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB102 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB103 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB104 1-469-094-21 s FERRITE, EMI (SMD) (1608)
Summary of Contents for HDC1000 series
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