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42
Parts to be replaced
6-7. Initial setting of adjustment values
6-8. Recording and displaying the Iop information
6-9. Temperature compensation offset adjustment
6-10. Laser power adjustment
6-11. Iop NV Save
6-12. Traverse adjustment
6-13. Focus bias adjustment
6-16. Auto gain control output level adjustment
6-6-4. Auto Check
6-2. PRECAUTIONS FOR CHECKING LASER DIODE
EMISSION
To check the emission of the laser diode during adjustments, never
view directly from the top as this may lose your eye-sight.
6-3. PRECAUTIONS FOR USE OF OPTICAL PICK-
UP (KMS-260B)
As the laser diode in the optical pick-up is easily damaged by static
electricity, solder the laser tap of the flexible board when using it.
Before disconnecting the connector, desolder first. Before connect-
ing the connector, be careful not to remove the solder. Also take
adequate measures to prevent damage by static electricity. Handle
the flexible board with care as it breaks easily.
Optical pick-up flexible board
6-4. PRECAUTIONS FOR ADJUSTMENTS
1) When replacing the following parts, perform the adjustments
and checks with
in the order shown in the following table.
2) Set the test mode when performing adjustments.
After completing the adjustments, exit the test mode.
Perform the adjustments and checks in “group S” of the test mode.
3) Perform the adjustments to be needed in the order shown.
4) Use the following tools and measuring devices.
• Check Disc (MD) TDYS-1
(Parts No. 4-963-646-01)
• Test Disk (MDW-74/GA-1) (Parts No. 4-229-747-01)
• Laser power meter LPM-8001 (Parts No. J-2501-046-A)
or
MD Laser power meter 8010S (Parts No. J-2501-145-A)
• Oscilloscope (Measure after performing CAL of prove.)
• Digital voltmeter
• Thermometer
• Jig for checking BD (MD) board waveform
(Parts No. : J-2501-196-A)
Optical
Pick-up
IC101
IC102
IC151
IC190
IC195
D101
pick-up
flexible board
laser tap
5) When observing several signals on the oscilloscope, etc.,
make sure that VC and ground do not connect inside the oscillo-
scope.
(VC and ground will become short-circuited.)
6) Using the above jig enables the waveform to be checked without
the need to solder.
(Refer to Servicing Note on page 10.)
7) As the disc used will affect the adjustment results, make sure
that no dusts nor fingerprints are attached to it.
Adjustment
Summary of Contents for HCD-ZX50MD
Page 9: ...9 BD CD BOARD To repair the BD CD board remove the bottom plate Bottom view ...
Page 66: ...HCD ZX50MD 66 66 7 11 SCHEMATIC DIAGRAM MAIN 1 4 SECTION See page 65 for Printed WIring Board ...
Page 67: ...HCD ZX50MD 67 67 7 12 SCHEMATIC DIAGRAM MAIN 2 4 SECTION See page 65 for Printed WIring Board ...
Page 75: ...HCD ZX50MD 75 75 7 20 SCHEMATIC DIAGRAM AMP US AEP UK G AED CIS model SECTION ...
Page 77: ...HCD ZX50MD 77 77 7 22 SCHEMATIC DIAGRAM AMP E MX AR HK MY SP KR AUS model SECTION ...
Page 81: ...HCD ZX50MD 81 81 7 26 SCHEMATIC DIAGRAM SWITCH SECTION ...
Page 83: ...HCD ZX50MD 83 83 7 28 SCHEMATIC DIAGRAM CD MECHANISM SECTION 09 Page 68 Page 68 R S ...
Page 116: ...116 MEMO ...