– 2 –
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
PARTS No.
4-212-711-0
π
4-212-712-0
π
MODEL
AEP, UK model
SP, HK model
• Abbreviation
HK
: Hong Kong model
SP
: Singapore model
Parts No.
MODEL NO. HCD-SD1
MODEL IDENTIFICATION
– Specification Label –
Summary of Contents for HCD-SD1
Page 27: ...HCD SD1 35 36 7 10 SCHEMATIC DIAGRAM PANEL SECTION Page 30 Page 30 ...
Page 29: ...HCD SD1 7 12 SCHEMATIC DIAGRAM AMP SECTION 39 40 Page 47 48 Page 43 Page 28 ...
Page 31: ...HCD SD1 7 14 SCHEMATIC DIAGRAM CONNECTOR SECTION 43 44 Page 30 Page 29 Page 40 Page 33 ...
Page 33: ...HCD SD1 7 16 SCHEMATIC DIAGRAM REG SECTION 47 48 Page 40 Page 29 Page 29 Page 33 ...
