![background image](http://html.mh-extra.com/html/sony/hcd-rg550/hcd-rg550_service-manual_420856030.webp)
30
30
HCD-RG550/RG660
5-8. PRINTED WIRING BOARD — CD MECHANISM SECTION (1/2) — • Refer to page 28 for “5-5. CIRCUIT BOARDS LOCATION”.
: Uses unleaded solder.
(Page 38)
C860
R860
C817
FB803
FB805
FB804
FB806
R806
R807
R747
C761
R761
R762
R746
3
4
5
IC801
IC802
BD BOARD
(SIDE A)
1-688-077-
(11)
11
OPTICAL
PICK-UP
BLOCK
(KSS-213D)
IC722
IC803
IC721
BD BOARD
(SIDE B)
1-688-077-
(11)
11
M702
(SPINDLE)
M
+
–
M701
(SLED)
M
+
–
S701
(LIMIT IN)
TP
(RF)
TP
(FE)
TP
(TE)
TP
(VC)
E
B
C
MAIN
BOARD
CN312
A
7
1
14
8
22
28
15
21
1
A
B
C
D
E
F
2
3
4
5
6
7
8
9
10
11
Ref. No.
Location
IC721
E-8
IC722
C-9
IC801
E-3
IC802
F-3
IC803
F-9
Q701
B-7
• Semiconductor
Location