29
29
HCD-HP8V
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
1
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER
J
: CD
h
: MD
L
: VIDEO
E
: PB (TAPE)
a
: REC (TAPE)
c
: DIGITAL OUT
• Abbreviation
E3
: 220-240 V AC area in E model.
EA
: Saudi Arabia model.
SP
: Singapore model.
TH
: Thai model.
• Indication of transistor
B
These are omitted.
C
E
Q
C
B
These are omitted.
E
Q
• Waveforms
– BD Board –
1
IC103
qg
(RFAC)
(CD Play Mode)
1.05
±
0.3 Vp-p
2
IC103
qh
(FE)
(CD Play Mode)
3
IC103
qk
(TE)
(CD Play Mode)
4
IC103
wk
(RFDCO)
(CD Play Mode)
Approx. 250 mVp-p
Approx. 350 mVp-p
200 mV/DIV, 400 ns/DIV
100 mV/DIV, 20
µ
s/DIV
100 mV/DIV, 20
µ
s/DIV
0.75
±
0.1 Vp-p
200 mV/DIV, 400 ns/DIV
5
IC601
qd
(XT2)
3.4Vp-p
30.5
µ
s
1V/DIV,
10
µ
s/DIV
1V/DIV,
40 ns/DIV
3Vp-p
6
IC601
qh
(CF2)
125 ns
– PANEL Board –
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
B
These are omitted.
C
E
Q
– MAIN Board –
12 Vp-p
13
µ
s
5V/DIV, 4
µ
s/DIV
7
Q207 collector(REC Mode)
B
C
E
These are omitted.
– VMP Board –
3.8 Vp-p
29.5 ns
1V/DIV, 20ns/DIV
8
IC505
<zb/
(XTAO)
2.9 Vp-p
37 ns
1V/DIV, 20ns/DIV
9
IC505
<x/m
(CLKB)
Note :
The components identified by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number specified.
Summary of Contents for HCD-HP8V
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