48
48
HCD-GX25/RG220
(Page 40)
(Page 40)
5-25. PRINTED WIRING BOARD — POWER AMP SECTION (HCD-RG220: EA MODEL) — • Refer to page 30 for Circuit Boards Location.
: Uses unleaded solder.
(Page 51)
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
CN502
CN501
(–)
(+)
L
R
SPEAKER
JK502
IMPEDANCE
USE 6–16
Ω
(
)
MAIN BOARD
CN306
MAIN BOARD
CN307
J3
TRANS BOARD
CN902
(11)
11
(HCD-RG220:EA)
1-689-641-
E
C
B
E C
B
E C
B
E
C
B
E
E
C
C
B
B
E
C
B
E
C
B
E
C
B
E
S
C
B
S
H3
G3
POWER AMP BOARD
EP501
EP01
C514
C517
C521
C518
C512
C522
C513
C511
LP903
LP902
EP502
C33
C24
C23
C22
C13
C41
C540
C37
C531
C12
C10
C11
C9
C34
R571
R501
R503
R99
R86
R81
R56
R502
R95
R92
R55
R537
R504
R538
R570
L502
C529
GX25,RG220:
EXCEPT AEP,UK,RU
GX25,RG220:
EXCEPT AEP,UK,RU
L501
RY501
D2
H-10
D3
F-9
D4
F-9
D5
F-9
D6
F-9
D11
F-7
D12
F-8
D13
F-9
D16
F-11
D17
F-11
D18
B-3
D19
B-3
D20
A-3
D23
E-4
D24
G-4
D25
E-4
D26
E-4
D27
F-4
D29
E-4
D30
E-5
D31
D-4
D32
D-4
D33
E-4
D34
E-4
D35
E-4
D36
E-4
D37
D-4
D38
D-4
D39
F-6
D40
F-6
D41
F-4
D42
F-4
D501
C-4
D502
B-4
D503
C-4
D504
B-4
D505
C-3
D506
B-3
D507
B-4
D508
A-4
D509
D-2
D510
B-4
D511
G-4
D513
I-5
D514
F-8
D515
I-10
Q5
F-8
Ref. No.
Location
• Semiconductor Location
Ref. No.
Location
Q6
F-8
Q7
F-7
Q8
F-8
Q9
F-8
Q10
B-3
Q11
B-3
Q12
A-3
Q13
A-4
Q17
G-4
Q18
F-4
Q19
F-3
Q20
D-4
Q21
D-5
Q22
E-4
Q23
E-4
Q24
D-4
Q501
E-2
Q502
C-2
Q503
D-2
Q504
B-2
Q505
F-2
Q506
D-3
Q507
E-3
Q508
C-3
Q509
E-3
Q510
C-3
Q511
C-4
Q512
B-3
Q513
C-4
Q514
A-3
Q515
C-4
Q516
B-4
Q517
C-4
Q518
B-4
Q519
C-4
Q520
B-4
Q521
C-4
Q522
A-4
Q523
C-4
Q524
A-4
Q525
C-4
Q526
B-5
Q527
F-5
Q529
I-4
Q530
H-6
Q534
I-9
Q535
I-8
Q536
I-8
