30
30
HCD-GX25/RG220
5-7. CIRCUIT BOARDS LOCATION
5-5. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
5-6. WAVEFORMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
(
) : CD PLAY
[
] : TAPE PLAY (DECK-A)
{
} : TAPE PLAY (DECK-B)
〈〈
〉〉
: REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (FM/AM)
J
: CD PLAY
E
: TAPE PLAY (DECK-A)
d
: TAPE PLAY (DECK-B)
G
: REC
j
: MD (VIDEO) IN
N
: MIC INPUT
• Abbreviation
CND : Canadian model
AUS
: Australian model
RU
: Russian model
EA
: Saudi Arabia model
MX
: Mexican model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
MAIN board
DRIVER board
SW board
MOTOR (LD) board
MOTOR (TB) board
VIDEO OUT board
BD board
SENSOR board
TRANS board
AMP board
H/P JACK board
GAME JACK board
PANEL board
REMOTE board
1 STREAM LED board
Note:
The components iden-
tified by mark
0
or dot-
ted line with mark
0
are critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque
0
sont cri-
tiques pour la sécurité.
Ne les remplacer que par
une piéce portant le numéro
spécifié.
– PANEL Board –
1
2
8.64MHz
IC601
qg
(CF1)
32.768kHz
IC601
qs
(XT1)
1.2Vp-p
1Vp-p
– MAIN Board –
(REC mode)
qa
1.7Vp-p
qs
15.8Vp-p
Q223 (Base)
Q223 (Collector)
11.3µs
11.3µs
– BD Board –
(CD PLAY mode)
1
2
IC721
4
(RF)
1.3Vp-p
3
4
IC721
qd
(FE)
Approx.
180
mVp-p
IC721
qg
(TE)
Approx.
150mVp-p
4Vp-p
16.9344MHz
IC721
rk
(XOUT)
