20
HCD-DZ555K/DZ556KB/DZ750K
3-13. MAIN BOARD (DZ555K/DZ556KB)
2
connector
2p (CN901)
1
connector
4p (CN3002)
Attaching the two radiation sheets
on the IC MAIN board first, and then
attach the heatsink (AMP).
heatsink (AMP)
radiation
sheets
IC on the
MAIN board
5
two screws (+BV 3
×
10)
7
heatsink (AMP),
HEATSINK B board,
HEATSINK A board
8
two radiation sheet
6
screw (+BVTP 3
×
12)
4
INSURATOR
board
3
two screws (+BV 3
×
6)
ql
seven screws
(+BV 3
×
6)
heatsink
(AMP)
harness
(D.C. fan)
harness
lead pin
screw
Clamp the harnesses with a lead pin or a similar tool so that
they do not touch this screw and the heatsink (AMP).
Clamp the harness with a lead pin
or a similar tool so that they do not
touch the heatsink (AMP).
q;
connector
6p (CN1201)
qs
connector
12p (CN906)
Route the power code according
to a white line on the
INSURATOR board.
Must not remove the power code
from the part of A of the
INSURATOR board.
power cord
INSURATOR
board
A
lead pin
lead pin
lead pin
9
wire (flat type) 24core (CN1101)
qa
wire (flat type)
5core (CN1202)
wire (flat type) 11core (CN4302)
qh
wire (flat type) 5core (CN702)
qj
screw
(+BVTP 3
×
8)
qk
screw
(+BVTP 3
×
8)
w;
MAIN board
qg
wire (flat type) 21core (CN502)
(DZ555K: SP, TH)
(DZ556KB: E12, E32, MX)
wire (flat type) 21core (CN605) (EXCEPT MX, E32)
wire (flat type) 17core (CN607) (MX, E32)
heatsink
(AMP)
harness
lead pin
harness
heatsink (AMP)
•
Abbreviation
E12 : 220 – 240V AC area in E model
E32 : 110 – 240V AC area in E model
MX : Mexican model
SP
: Singapore model
TH
: Thai model
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