HCD-DX8
21
21
PANEL board
LEAF SW board
HEAD (A) board
HEAD (B) board
TRANS board
CD SWITCH board
BD board
DRIVER board
MOTOR board
SENSOR board
MAIN board
POWER AMP board
SECTION 7
DIAGRAMS
7-1. CIRCUIT BOARDS LOCATION
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• WAVEFORMS
1
IC101
yj
CD PLAY MODE
6.4Vp-p
16.9344MHz
1.2Vp-p
2
IC101
ta
CD PLAY MODE
3
IC101
ra
CD PLAY MODE
4
IC101
el
CD PLAY MODE
400nsec/div
approx 200mVp-p
approx 170mVp-p
1
IC401
qa
STOP MODE
3.0Vp-p
32.768kHz
3.4Vp-p
2
IC401
qd
STOP MODE
3
T301
4
TAPE B REC MODE
16MHz
120Vp-p
80.7kHz
1
IC601
oa
STOP MODE
4.8Vp-p
12.5MHz
– BD BOARD –
– MAIN BOARD –
– PANEL BOARD –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal component.
•
2
: nonflammable resistor.
•
5
: fusible resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c
: digital out
• Abbreviation
AUS
: Australian model
EA
: Saudi Arabia model
MX
: Mexican model
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
b
: Pattern from the side which enables seeing.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
