HBD-E770W
HBD-E770W
60
60
5-33. PRINTED WIRING BOARD - REG Board -
G S
R402
R404
R406
R411
R415
R417
R420
R421
R422
R423
C400
C403
C404
C408
C409
C411
C412
C414
C415
C428
D402
D403
D405
CL400
CL401
CL402
CL404
CL405
CL406
CL407
CL408
CL409
CL410
CL411
CL412
CL414
CL415
CL416
CL417
CL418
CL419
CL420
CL421
CL422
Q401
Q402
L401
1
13
3
1
12
1
3
13
CN400
CN402
CN403
LP400
LP401
C401
C405
C426
C431
JW400
JW401
JW402
JW403
JW404
JW405
JW406
JW407
JW408
JW409
JW410
JW412
JW413
JW414
JW416
JW417
JW418
JW419
ET400
JW421
1 3
4
5
1 3
4
5
(CHASSIS)
E
REG BOARD
1-880-752-
13
(13)
D407
D406
A
B
C
D
1
2
3
4
•
: Uses unleaded solder.
• See page 34 for Circuit Boards Location.
• Waveforms
– MAIN Board –
– INCLUDE Board –
2
IC703
qh
(RMCK)
1 V/DIV, 20 ns/DIV
4.4 Vp-p
40.6
ns
3
IC703
qj
(RBCK)
1 V/DIV, 200 ns/DIV
324
ns
4.2 Vp-p
20.8
P
s
3.9 Vp-p
4
IC703
w;
(RLRCK)
20.8
P
s
3.4 Vp-p
qs
IC206
7
(LRCK)
1 V/DIV, 10
P
s/DIV
5
1
IC501
qd
(Xout)
1 V/DIV, 100 ns/DIV
166
ns
3.3 Vp-p
6
IC3010
rk
(XFSOIN)
1 V/DIV, 10 ns/DIV
20.4
ns
4 Vp-p
qa
IC200
3
(2A)
500 mV/DIV, 50 ns/DIV
81
ns
1.6 Vp-p
qd
IC206
8
(BCK)
1 V/DIV, 200 ns/DIV
324
ns
3.4 Vp-p
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9
9
2
8
9
4
2
9
8
T E L
1 3 9 4 2 2 9 6 5 1 3
2
8
9
4
2
9
8
0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299