5-15
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
HDR-TG5/TG5E/TG5V/TG5VE/TG7VE_L2
A-1709-853-A MS-423 BOARD, COMPLETE
***********************
(MS7308 and BT901 (lithium battery) are not
included in MS-423 complete board.)
< BATTERY SOCKET >
0
BH7301 1-251-928-21 SOCKET, BATTERY
< BATTERY >
0
BT901
1-756-134-12 BATTERY, STORAGE, LITHIUM
< CAPACITOR >
C5001
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C5002
1-114-238-91 CERAMIC CHIP
22uF
20%
10V
C5003
1-162-960-11 CERAMIC CHIP
220PF
10%
50V
*
C5004
1-112-746-11 CERAMIC CHIP
4.7uF
10%
6.3V
C5005
1-162-915-11 CERAMIC CHIP
10PF
0.5PF
50V
C6001
1-100-581-81 CERAMIC CHIP
0.0047uF
10%
50V
C6002
1-100-581-81 CERAMIC CHIP
0.0047uF
10%
50V
C6024
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C6025
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C6031
1-112-534-11 CERAMIC CHIP
10uF
20%
6.3V
C6032
1-127-895-91 TANTAL. CHIP
22uF
20%
4V
C6033
1-165-884-11 CERAMIC CHIP
2.2uF
10%
6.3V
C6034
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6035
1-164-739-11 CERAMIC CHIP
560PF
5%
50V
C6037
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6038
1-100-786-91 TANTAL. CHIP
22uF
20%
6.3V
C6039
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C6040
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
C6041
1-100-567-81 CERAMIC CHIP
0.01uF
10%
25V
*
C6044
1-112-746-11 CERAMIC CHIP
4.7uF
10%
6.3V
*
C6045
1-112-746-11 CERAMIC CHIP
4.7uF
10%
6.3V
C6046
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C6047
1-125-889-11 CERAMIC CHIP
2.2uF
10%
10V
C7301
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7302
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
C7304
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
C7305
1-112-717-91 CERAMIC CHIP
1uF
10%
6.3V
C7307
1-165-908-11 CERAMIC CHIP
1uF
10%
10V
C7308
1-125-777-11 CERAMIC CHIP
0.1uF
10%
10V
< CONNECTOR >
*
CN7301 1-817-829-81 CONNECTOR, FPC (ZIF) 27P
*
CN7302 1-817-830-71 CONNECTOR, FPC (ZIF) 33P
CN7303 1-816-655-61 CONNECTOR, FFC/FPC 8P
*
CN7304 1-817-942-81 CONNECTOR, FPC (ZIF) 39P
*
CN7305 1-816-644-51 FFC/FPC CONNECTOR (LIF) 12P
CN7306 1-819-611-31 MEMORY STICK DUO CONNECTOR 10P
CN7308 1-822-532-11 CONNECTOR, CARD (SIP)
< DIODE >
D5001
6-500-619-01 DIODE RB520S-40TE61
0
D5002
6-501-096-01 DIODE CRF02 (TE85R)
D7301
6-501-216-01 DIODE CL-271HR-C-TS (MS ACCESS)
*
D7302
6-501-955-01 DIODE MAZS056G08S0
< FERRITE BEAD >
FB7301 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7302 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7303 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7304 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7305 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7306 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7307 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB7308 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
< IC >
0
*
IC5001 6-712-975-01 IC BD4215NUV-E2
IC6001
8-753-229-95 IC CXM3006CER-T4
*
IC7301
6-708-445-01 IC R1114Q291D-TR-FA
*
IC7302
6-708-445-01 IC R1114Q291D-TR-FA
< COIL >
*
L5001
1-400-820-11 INDUCTOR
2.2uH
L6001
1-400-588-11 INDUCTOR
10uH
L6002
1-400-588-11 INDUCTOR
10uH
L6003
1-400-588-11 INDUCTOR
10uH
< INTERNAL MEMORY >
MS7308 1-487-365-11 MEMORY MODULE, SIP (16GB) (TG5/TG5E)
(Note 1)
MS7308 A-1716-857-A SERVICE, MEMORY MODULE SIP 16GB
(TG5V/TG5VE/TG7VE) (Note 1, 2)
< TRANSISTOR >
*
Q5001
6-551-852-01 TRANSISTOR
UP04313G08S0
0
*
Q5002 6-552-144-01 TRANSISTOR
TIG052TS-TL-E
Q6001
8-729-427-37 TRANSISTOR
XP411F-TXE
Q6002
8-729-427-67 TRANSISTOR
XP421F-TXE
Q6010
6-550-601-01 TRANSISTOR
UNRF2A300AS0
Q6011
6-551-184-01 TRANSISTOR
MCH6305-TL-E-S
*
Q6013
6-551-157-01 TRANSISTOR
2SA207900AS0
• Refer to page 5-1 for mark
0
.
注意
電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と交換
してください。
使用済み電池は，取扱指示に従って処分してください。
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Note 1: When replacing the internal memory (MS7308 that has
been inserted in the MS-423 board), start the Adjust
Manual in the Adjust Station and refer to the “INTERNAL
MEMORY ADJUSTMENTS”.
Note 1:
内蔵メモリー（MS-423基板に挿入されたMS7308）を交
換の際は，Adjust StationからAdjust Manualを起動させて
「INTERNAL MEMORY ADJUSTMENTS」を参照してく
ださい。
Note 2: Do not factory check the internal memory (MS7308 that
has been inserted in the MS-423 board) in which Map
Data is installed (TG5V/TG5VE/TG7VE). The map data is
erased when the factory check is done.
Note 2:
地図データ入り内蔵メモリー（MS-423基板に挿入された
MS7308）（TG5V/TG5VE/TG7VE）にはファクトリー
チェックを行わないでください。ファクトリーチェック
を行うと，地図データが消去されてしまいます。
MS-423
