ECM-DM5P
2
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SECTION 1
SERVICING NOTES
1
Twist the lead wire show in
arrow direction.
2
Insert the lead wire then return twist.
4
Soldering white lead wire.
5
Screen.
3
Soldering gray
lead wire
to "V" shape
patarn side.
7
Insert the MIC1.
Paying attention as
lead wire isn't niped in.
P1
Lead wire (A32)
Case, microphone
Arm (rear)
Arm (front)
C1
MIC1
OK
MIC1
Arm (front)
Arm (front)
NG
MIC1
MIC1
8
6
Note:
When remove solder front P1,
change the lead wire
(A32) for new one.
MIC1 INSTALLATION
