– 20 –
CXP854P60
Package Outline
Unit: mm
64PIN
SDIP (PLASTIC)
MI
N
0.
5
MI
N
3.
0
4.
75 – 0.
1
0.9
±
0.15
0.5
±
0.1
0.
25 – 0.
05
+ 0.
1
17.
1
– 0.
1
19.
0
5
1
32
33
64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.
3
+ 0.
3
0˚ to 15˚
PACKAGE STRUCTURE
64PIN
SDIP (PLASTIC)
MI
N
0.
5
MI
N
3.
0
4.
75
–
0.
1
0.9
±
0.15
0.5
±
0.1
0.
25
–
0.
05
+ 0.
1
17.
1
–
0.
1
19.
0
5
1
32
33
64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.
3
+ 0.
3
0˚ to 15˚
PACKAGE STRUCTURE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
ALLOY 42
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS
5-18
µ
m
SPEC.