Sony CDX-L550, Service Manual

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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 3
Getting Started ......................................................................... 3
CD Player ................................................................................ 4
Radio ....................................................................................... 4
RDS ......................................................................................... 5
Connections ............................................................................. 7
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 8
2-2. CD Mechanism Block ......................................................... 8
2-3. Main Board ......................................................................... 8
2-4. Heat Sink ............................................................................. 9
2-5. Chassis (T.U) Assy .............................................................. 9
2-6. Disc In Board, Guid (Disc) ............................................... 10
2-7. Servo Board ....................................................................... 10
2-8. Arm Roller Assy ................................................................ 11
2-9. Chassis (OP) Assy ............................................................. 11
2-10. Optical Pick-up Block ....................................................... 12
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 13
3-2. Block Diagram –CD Section– ........................................... 15
3-3. Block Diagram –Tuner Section– ....................................... 16
3-4. Block Diagram –Display Section– .................................... 17
3-5. Circuit Boards Location .................................................... 17
3-6. Printed Wiring Boards –CD Mechanism Section– ............ 18
3-7. Schematic Diagram –CD Mechanism Section– ................ 20
3-8. Printed Wiring Board –Main Section– .............................. 21
3-9. Schematic Diagram –Main Section (1/2)– ........................ 22
3-10. Schematic Diagram –Main Section (2/2)– ........................ 23
3-11. Printed Wiring Board –Sub (CD) Section– ....................... 24
3-12. Schematic Diagram –Sub (CD) Section– .......................... 25
3-13. Schematic Diagram –Key Section– .................................. 26
3-14. Printed Wiring Board
–Key Section (L550/L550X)– ........................................... 27
3-15. Printed Wiring Board –Key Section (L550V)– ................. 28
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 32
4-2. Front Panel Section ........................................................... 33
4-3. CD Mechanism Section (1) ............................................... 34
4-4. CD Mechanism Section (2) ............................................... 35
4-5. CD Mechanism Section (3) ............................................... 36
5. ELECTRICAL PARTS LIST
........................................ 37
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SERVICE NOTES
This label is located on the bottom of the chassis.
This label is located on the drive unit's internal
chassis.
When replacing the chassis (T.U) of mechanism deck which have
the “CAUTION LABEL” attached, please be sure to put a new
CAUTION LABEL (3-223-913-11) to the chassis (T.U).
CDX-L550/L550V/L550X
AEP/UK model: