- 3 -
SE1A
RM-ED009
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under the
following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
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CAUTION
SECTION 1 GENERAL
Summary of Contents for Bravia KDL-26T3000
Page 9: ... 8 SE1A RM ED009 SECTION 2 DISASSEMBLY 2 2 STAND REMOVAL 2 1 REAR COVER REMOVAL ...
Page 10: ... 9 SE1A RM ED009 2 3 COVER UNDER REMOVAL 2 4 AC INLET REMOVAL ...
Page 11: ... 10 SE1A RM ED009 2 5 LOUD SPEAKER REMOVAL 2 6 H1 BOARD REMOVAL ...
Page 12: ... 11 SE1A RM ED009 2 7 BC BOARD REMOVAL ...
Page 13: ... 12 SE1A RM ED009 2 8 U1 26 inches or U2 32 and 40 inches BOARD REMOVAL 2 9 H2 BOARD REMOVAL ...
Page 15: ... 14 SE1A RM ED009 2 12 VESA ARM and LCD PANEL REMOVAL 26 and 32 inches ...
Page 16: ... 15 SE1A RM ED009 2 13 VESA ARM and LCD PANEL REMOVAL 40 inches ...