Sony AM-NX9, Service Manual

Page: 33 / 62

AM-NX9
33 33
6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate layers have not
been included in this diagrams.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (JK951).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
(
) : REC
〈〈 〉〉
: USB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
f
: REC
F
: USB
• Abbreviation
EE : East European model
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
2.3 Vp-p
5.67 ns
2.7 Vp-p
21 ns
1.2 Vp-p
Approx.
400 mVp-p
Approx.
350 mVp-p
• Waveforms
1 IC501
9
(RFO)
3
IC501
rs
(FE)
4 IC601
4
(CLK)
5 IC801
2
(OSCO)
6
IC801
<z,/>
(UOSCO) (USB mode)
7
IC901
yd
(CLK)
2
IC501
rd
(TE)
2.3 Vp-p
5.67 ns
2.1 Vp-p
44.6 ns
Ver 1.1
∗
Replacement of IC501 and IC801 used in this set re-
quires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
∗
Replacement of IC501 and IC801 used in this set re-
quires a special tool.