Softing Data Flow commModule MBP, Hardware Manual

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Chapter 6 - Mechanical specification
© Softing Industrial Automation GmbH
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6.3 Mounting process
The PCB is made of FR4 and has a NiAu surface finish. We strongly recommend that commModule MBP
modules are not soldered more than once after shipping by Softing.
The soldering of the communication module is compliant with RoHS directive 2011/65.
Note
It is recommended to perform electrical, climate, stress and vibration tests on the final
assembled product to verify that the manufacturing process has not damaged the
commModule MBP. CommModule MBP are moisture sensitive devices.
Reflow recommendations
The following temperatures and times are recommended for variant commModule MBP #STD_NOP:
Ramp up rate 3°C/second max
Maximum time maintained above 217°C 40 -60 seconds
Peak reflow temperature 245°C
Ramp down rate 4°C/second max
Note
Variant commModule MBP #STD must be soldered by hand.
6.4 ESD handling precautions
The commModule MBP contains highly sensitive electronic circuitry and is an Electrostatic
Sensitive Device (ESD). Observe precautions for safe handling! Failure to observe these
precautions can result in severe damage to the module.
6.5 Packaging and labeling
CommModule MBP are moisture sensitive devices. They are shipped in ESD safe trays measuring
approximately 136 x 315 mm.
Storage and Drying
The packaging may not exceed the max. temperature of 60°C.
Labeling