EVB-USB2660/USB2660i Evaluation Board Revision A User Manual
Revision 1.0 (06-09-09)
6
SMSC EVB-USB2660/60i Revision A
USER MANUAL
The component side top layer is shown in
with silk screen information to identify component
locations.
Layer 1
1.9 - 2.8 mil, finished
Pre-preg
4.25 mil, +/- 0.25 mil FR-4
Layer 2
1.3 mil (nominal)
Core
~45 mil FR-4
Layer 3
1.3 mil (nominal)
Pre-preg
4.25 mil, +/- 0.25 mil FR-4
Layer 4
1.9 - 2.8 mil, finished
Solder mask
Solder Side
Table 2.2 PCB layer stack