
E M 3 5 8 x
52
Rev 1.0
MIN
TYP
MAX
C1
C2
X1
X2
Y1
Y2
E
a0
a1
a2
b0
b1
b2
6.85
6.85
0.30
5.35
0.90
5.35
0.50
1.80
1.625
0.75
1.80
1.625
0.75
6.1.1. QFN48 Footprint Recommendations
Figure 6.3 demonstrates the IPC-7351 recommended PCB Footprint for the EM358x (QFN50P700X700X90-49N).
A ground pad in the bottom center of the package forms a 49th pin.
A 3 x 3 array of non-thermal vias should connect the EM358x decal center shown in Figure 6.3 to the PCB ground
plane through the ground pad. In order to properly solder the EM358x to the footprint, the Paste Mask layer should
have a 3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm (center to center)
apart, as shown in Figure 6.4. This will cause an evenly distributed solder flow and coplanar attachment to the
PCB. The solder mask layer (illustrated in Figure 6.5) should be the same as the copper layer for the EM358x
footprint.
For more information on the package footprint, please refer to the appropriate
EM358x Reference Design
.
X2
Via Drill DIA = 0.254mm
b2
b0
a1
E
b1
C2
Y2
Y1
a2
X1
a0
C1
* Dimensions in mm
* Dimensions are for
Figures 19-2, 19-3
and 19-4
Figure 6.3. PCB Footprint for the EM358x
a0
a1
DIA = 1.01mm
b0
b1
C2
Y1
E
X1
C1
Figure 6.4. Paste Mask