WA_DEV_LG_UGD_001
Rev 002
March 30, 2011
36
Migration Guide
Hardware Compatibility
4.3.
Stencil Design
For SL6087,
DO NOT
open the stencil for the 16 center GND pads as shown in the figure below.
Figure 9.
Stencil Design for the SL6087
4.4.
Mechanical Differences
The
module thickness varies depending on the
SL
series embedded
module.
The following table
enumerates the thickness of each SL series embedded module.
Table 26.
Thickness of the SL Series Embedded Modules
SL6087
SL808x
SL809x
SL501x
Thickness
2.65mm (typical)
2.85mm (max)
2.40mm (typical)*
2.55mm (max)
2.40mm (typical)*
2.55mm (max)
2.47mm (typical)
2.50mm (max)
*
The specified module thickness
includes the thickness of the module’s label. The typical module thickness
without label is 2.35mm.