WA_DEV_LG_UGD_001
Rev 002
March 30, 2011
35
Migration Guide
Hardware Compatibility
4.2.
Soldering Pad Design
The application PCB will be the same among the SL series embedded modules. Nevertheless, a
different Solder Mask will be used for the case of SL6087 to cover the 2
nd
row of GND pads and to
prevent soldering those pads.
Figure 8.
Recommended Soldering PAD Design
When the SL6087 is used, the highlighted GND pads should be covered by Solder Mask.
Warning:
It is recommended to have a GROUND area under the SL series module; this ground area should
be a whole area of copper with proper ground vias to provide a good grounding system between the
application and the embedded module and improved thermal dissipation. It should be covered by
solder resist on the non-soldered area.
The ground vias may be micro-vias, filled or unfilled.
For SL6087 modules, the ground vias should not be placed in the test points
’ location.
In any case, there shall not be any SIGNAL-trace or SIGNAL-hole/micro-via other than GROUND
under the AirPrime SL Series product.
For more details, refer to document [5]
AirPrime SL Series Customer Process Guidelines