Technical information
8.4 Technical specifications
SIMATIC IPC477D, IPC477D PRO
222
Operating Instructions, 11/2016, A5E31347228-AF
8.4.2.2
Ambient conditions PRO device
Climatic ambient conditions
Maximum permitted ambient temperature during operation
Temperature, tested according to IEC 60068-2-1, IEC 60068-2-2
Touch devices
Temperature during storage/transport
Storage/transport, gradient
-20 °C to +60 °C
Max. 20 °C/h, no condensation
Intel Celeron processor
all mounting positions
1
With SSD:
CFast only:
+0 to +45 °C
+0 to +45 °C
Intel i3 or i7 processor
all mounting positions
1
With SSD:
CFast only:
+0 to +40 °C
+0 to +45 °C
1
See "Permissible mounting positions" in the section "Installing and connecting the device", "Preparing installation",
"PRO device".
Relative humidity, tested in accordance with IEC 60068-2-78, IEC 60068-2-30
Operation
5 ... 85% at 30 °C, no condensation
Storage/transport
5 to 95 % at 25/55 °C, no condensation
Air pressure, in accordance with IEC 60068-2-13
Operation
1080 hPa to 795 hPa, corresponds to an elevation of 1000 m to 2000 m
Storage/transport
1080 hPa to 660 hPa, corresponds to an elevation of 1000 m to 3500 m
Mechanical ambient conditions
Vibration, tested according to DIN IEC 60068-2-6
Operation with CFast and
SSD
5 Hz to 8.4 Hz: 3.5 mm
8.4 to 200 Hz: 9.8 m/s
2
Storage/transport
5 to 8.4 Hz: 3.5 mm
8.4 to 200 Hz: 9.8 m/s
2
Shock resistance, tested in accordance with IEC 60068-2-27, IEC 60068-2-29
Operation
50 m/s
2
, 30 ms
Storage/transport
250 m/s
2
, 6 ms