SICK Device
System
Controller
Sensor
I
U
Connection
Module
1
2
3
5
6
7
8
9
ß
à
4
1
Grounding point 1
2
Ground potential difference
3
Grounding point 2
4
Closed current loop with equalizing currents via cable shield
5
Metal housing
6
Plastic housing
7
Shielded electrical cable
8
Device
9
Sensor
ß
Connection modules
à
System controller
If the peripheral devices have metal housings and the cable shields are also in contact
with their housings, it is assumed that all devices involved in the installation have the
same ground potential
.
This is achieved by complying with the following conditions:
■
Mounting the devices on conductive metal surfaces
■
Correctly grounding the devices and metal surfaces in the system
■
If necessary: low-impedance and current-carrying equipotential bonding between
areas with different ground potentials
SICK
Device
7
4
6
Power Supply
U
=
8
=
9
1
2
3
I
5
System
Controller
Figure 1: Example: Occurrence of equipotential bonding currents in the system configuration
1
System controller
2
Device
3
Voltage supply
4
Grounding point 2
5
Closed current loop with equalizing currents via cable shield
6
ELECTRICAL INSTALLATION
14
O P E R A T I N G I N S T R U C T I O N S | CDB650
8021689/ZZN2/2021-05-07 | SICK
Subject to change without notice
