μ
Q7-962
μ
Q7-962 User Manual - Rev. First Edition: 1.0 - Last Edition: 3.1 - Author: S.B. - Reviewed by P.Z Copyright © 2016 SECO S.r.l.
39
4.1
Thermal Design
Highly integrated modules, like the
μ
Q7-962 module, offer the user excellent performance in a very reduced space, therefore allowing the system
’
s minimization.
On the other hand, the miniaturizing of IC
’
s and the increase of clock frequencies of the processors lead to the generation of a big amount of heat that must be
dissipated to prevent critical operating conditions, system hang-off or failures.
It is extremely important to note that, for this reason, a critical design parameter always to be kept in very high consideration is the thermal design and analysis of the
final assembled system, with the application software running.
Qseven
®
specifications take into account the use of a heatspreader, which will act only as thermal coupling device between the Qseven
®
module and an external
dissipating surface/cooler. The heatspreader also needs to be thermally coupled to all the heat generating surfaces using a thermal gap pad, which will optimise the
heat exchange between the module and the heatspreader.
The heatspreader is not intended to be a cooling system by itself, but only as means for transferring heat to another surface/cooler, like heatsinks, fans, heat pipes
and so on.
Conversely, heatsinks in some situation can represent the cooling solution. Until the module is used on a development Carrier board, on free air, just for software
development and system tuning, then a finned heatsink could be sufficient for module
’
s cooling. Anyhow, please remember that all depends also on the workload
of the processor. Heavy computational tasks will generate much heat with all processor versions.
Therefore, it is always necessary that the customer study and develop accurately the cooling solution for his system, by evaluating processor
’
s workload, utilisation
scenarios, the enclosures of the system, the air flow and so on. This is particularly needed for industrial grade modules.
SECO can provide
μ
Q7-962 specific heatspreaders and heatsinks, but please remember that their use must be evaluated accurately inside the final system, and
that they should be used only as a part of a more comprehensive ad-hoc cooling solutions.
Ordering Code
Description
Q962-DISS-1-C-PK
μ
Q7-962 Heat Spreader (Passive) for COMMERCIAL VERSION & also Solo & DualLite INDUSTRIAL, Packaged
Q962-DISS-1-I-PK
μ
Q7-962 Heat Spreader (Passive) for Dual & Quad (AUTOMOTIVE & INDUSTRIAL), Packaged
Q962-DISS-2-C-PK
μ
Q7-962 HeatSink (Passive) for COMMERCIAL VERSION & also Solo & DualLite INDUSTRIAL, Packaged
Q962-DISS-2-I-PK
μ
Q7-962 HeatSink (Passive) for Dual & Quad (AUTOMOTIVE & INDUSTRIAL), Packaged
