2.2
Technical Specifications
Processors
NXP i.MX6 Family, based on ARM
®
CORTEX-A9 processors
-
i.MX6S Solo - Single core up to 1GHz
-
i.MX6D Dual - Dual core up to 1.2GHz per core
-
i.MX6DL Dual Lite - Dual core up to 1GHz per core
-
i.MX6Q Quad - Quad core up to 1.2GHz per core
Memory
Up to 4GB DDR3 onboard (up to 2GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL
®
ES2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG
™
(only i.MX6D and
i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video Interface
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface
HDMI Interface
Video Input Port / Camera Connector
Video Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
Onboard eMMC Disk, up to 32 GB *
SD/MMC/SDIO interface
1 x
μ
SD Card Slot onboard
1 x External S-ATA Channel (only available with i.MX6D and i.MX6Q)
* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.
Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global
capacity shown for Disk Properties will be less than expected. Please also consider
that a portion of disk capacity will be used by internal Flash Controller for Disk
management, so final capacity will be lower.
USB
1 x USB OTG interface
4 x USB2.0 Host interfaces
Networking
Gigabit Ethernet interface
Audio
AC
’
97 Audio interface
PCI Express
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Serial Ports
2 x Serial ports (TTL interface)
CAN port interface
Other Interfaces
I2C bus
LPC Bus
SM Bus
Power Management Signals
Power supply voltage: +5V
DC
± 5%
Operating temperature: 0°C ÷ +60°C (commercial version) **
-40°C ÷ +85°C (industrial version) **
Dimensions: 70 x70 mm (2.76
”
x 2.76
”
)
Supported Operating Systems:
Linux
Android
Windows Embedded Compact 7
** Temperatures indicated are the maximum temperature that the
heatspreader / heatsink can reach in any of its parts. This means that it is
customer
’
s responsibility to use any passive cooling solution along with an
application-dependent cooling system, capable to ensure that the
heatspreader / heatsink temperature remains in the range above indicated.
Please also check paragraph 4.1
